Download Embedded mechatronic systems. / Volume 2, Analysis of by Abdelkhalak El Hami, Philippe Pougnet PDF

By Abdelkhalak El Hami, Philippe Pougnet

In operation, mechatronics embedded platforms are under pressure by way of a great deal of various explanations: weather (temperature, humidity), vibration, electric and electromagnetic. those stresses in parts result in failure mechanisms may be pointed out and modeled for greater keep an eye on. AUDACE is a collaborative undertaking of the cluster Mov'eo that deal with concerns particular to mechatronic reliability embedded structures. AUDACE ability studying the reasons of failure of elements of mechatronic structures onboard. The target of the venture is to optimize the layout of mechatronic units via reliability.

The undertaking brings jointly public quarter laboratories that experience services in research and modeling of failure, significant teams of mechatronics (Valeo and Thales) within the automobile and aerospace and small and medium businesses that experience abilities in characterization and validation tests.

This ebook can help you to:

  • Find and improve how you can symbolize and validate the layout robustness and reliability of complicated mechatronic devices
  • Develop how you can signify actual and chemical phenomena,
  • Identify mechanisms of failure of parts of those devices,
  • Analyze the actual and / or chemical mechanisms of failure, so as of importance
  • To version failure mechanisms and layout optimization.

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Extra resources for Embedded mechatronic systems. / Volume 2, Analysis of failures, modeling, simulation and optimization

Sample text

1. Opening ceramic and resin casings Two packaging techniques are used for the electronic chips of this study: – the chip is coated with resin (D2PAK package and GaN45W package); – the chip and its circuit board are located in a ceramic casing (LDMOS package) Casing opening techniques should maintain the operational and structural integrity of the component. Depending on the materials and the size of the samples, three casing opening techniques are used: 52 Embedded Mechatronic Systems 2 – mechanical opening which uses a controllable micromilling machine.

C. , “Hot carrier reliability in GaAs PHEMT MMIC power amplifiers”, IEEE 43rd Annual International Reliability Physics Symposium, San Jose, CA, 2005. 48 Embedded Mechatronic Systems 2 [DHE 14] DHERBECOURT P. , “Realization of a dedicated bench for reliability and robustness studies of high LDMOS power transistors”, International Journal of Microwave and Optical Technology, vol. 9, no. 6, pp. 429–436, 2014. S. , “Analysis of the electrical characteristics of power LDMOSFETs having different design parameters under various temperature”, Microelectronics Journal, vol.

Thereafter, a mechanical method is used to delicately separate the component from the case. 2(b)). 2. Opening of power transistor LDMOS 330W by laser ablation. a) Deterioration of the bonding heads following the use of the laser. b) X-ray image to ascertain the thickness of the ceramic to be removed. 1. 1. 2. 3). 3. Confocal IR photoelectron microscope with OBIRCh. A double-sided probe system is fitted to this equipment Physical Defects Analysis of Mechatronic Systems 55 The detection of photons requires direct access between the emitting area and the detection system.

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